View Issue Details
| ID | Project | Category | View Status | Date Submitted | Last Update |
|---|---|---|---|---|---|
| 0001682 | T99X171.00 SKB Eagle | General | public | 2023-03-20 15:58 | 2025-04-07 10:08 |
| Reporter | (ALTech) SH Son | Assigned To | Due Date | ||
| Priority | normal | Severity | s3-moderate | Reproducibility | have not tried |
| Status | closed | Resolution | fixed | ||
| Summary | 0001682: [SWAN] PCB Solderability Test | ||||
| Description | [SWAN] PCB Solderability Test | ||||
| Tags | No tags attached. | ||||
| Attach Tags | |||||
| User List |
(ALTech) BY Lee , (ALTech) Hyunsik Kim , (ALTech) JW Kim , (ALTech) Lonnie Kim , (ALTech) SH Son , (ALTech) Sophie Lee , |
|---|
|
|
NO CUST_KP_NO Description Date Code STOCK_ QTY 1 308.03584.055 PCB 4L OSP REV.055 2PCS GP 12* 2022-04-16 100 2022-08-27 2036 2022-08-06 6314 2022-08-20 486 8936 2 308.03582.055 PCB 4L OSP REV.055 2PCS GP 16* 2022-04-16 100 2022-08-06 6314 2022-08-20 486 2022-08-27 2036 8936 3 308.03583.055 PCB 4L OSP REV.055 2PCS GP 30* 2022-08-06 6314 2022-08-20 486 2022-08-27 2036 2022-04-16 100 8936 4 308.03648.055 PCB 4L OSP REV.055 2PCS GP 30* 2022-08-20 486 2022-08-27 2036 2022-04-16 100 2022-08-06 6314 8936 5 308.03523.135 PCB 8L OSP REV.135 2PCS GP 75* 2022-06-18 118 2022-08-27 6084 6202 6 308.03524.055 PCB 4L OSP REV.055 2PCS GP 75* 2022-08-27 2036 2022-08-06 6314 2022-08-20 486 2022-04-16 100 8936 7 308.03581.055 PCB 4L OSP REV.055 2PCS GP 37* 2022-08-27 2036 2022-08-06 6314 2022-04-16 100 2022-08-20 486 8936 |
|
|
oldest PCB test report |
|
|
|
|
|
For the next PCB Solderability Test, Please follow my instruction below 1. Please proceed SMD -> PTH for Solderability Test A. SMD Test point : same as this check point + add Bottom side (Main and Amp PCB) 308.03523.135 PCB 8L OSP REV.135 2PCS GP 75 308.03524.055 PCB 4L OSP REV.055 2PCS GP 75* B. Add PTH test point for Main and Amp PCB. 308.03523.135 PCB 8L OSP REV.135 2PCS GP 75 308.03524.055 PCB 4L OSP REV.055 2PCS GP 75* C. Under the same conditions as mass production Same solder paste(SMD), please add the solder information Flux and Solder(PTH) Test : Same Solder paste(SMD), Flux and Solder(PTH) 2. Test procedure : SMD -> PTH Solderability Test A. SMD 1. Bottom side Screen print -> Reflow -> SMD Solderability bottom 2. Top side Screen print -> Reflow -> SMD Solder ability top test B. PTH (Main PCB) Need to proceed with SMD tested board (top/bottom reflowed) Flux -> wave soldering 1. PTH Solder ability test If you have any question, please contact me. Thanks SON |
|
|
HI Miya As we discussed about PCB rework from vendor OSP re-treatment, it is no problem to MP use. in my instruction (0001682:0012581) was criteria for determining whether it can be used without re treatment OSP. So, Please use all these PCBs before the expiration date. Thanks SON |
| Date Modified | Username | Field | Change |
|---|---|---|---|
| 2023-03-20 15:58 | (ALTech) SH Son | New Issue | |
| 2023-03-20 16:00 | (ALTech) SH Son | Note Added: 0012578 | |
| 2023-03-20 16:00 | (ALTech) SH Son | File Added: image.png | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) BY Lee | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) Hyunsik Kim | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) JW Kim | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) Lonnie Kim | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) SH Son | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) Sophie Lee | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) Sun Choul Joung | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (ALTech) SY Yoon | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (MFG) An Tran | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (MFG) Ben Trinh | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (MFG) Yuri Ruan | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (PM) Dennis Lu | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (PM) Sheila Tu | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (PM) Tiffanie Lai | |
| 2023-03-20 16:44 | (ALTech) SH Son | Issue Monitored: (Sales) Miya Wang | |
| 2023-03-20 16:45 | (ALTech) SH Son | Assigned To | => (Sales) Miya Wang |
| 2023-03-20 16:45 | (ALTech) SH Son | Status | new => assigned |
| 2023-03-20 16:46 | (ALTech) SH Son | Note Added: 0012579 | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: image-2.png | |
| 2023-03-20 16:46 | (ALTech) SH Son | Note Added: 0012580 | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-07 Solderability Test Report_JBD_SQE_308.03583.055_2215.pdf | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-09 Solderability Test Report_JBD_SQE_308.03584.055_2215.pdf | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-11 Solderability Test Report_JBD_SQE_308.03648.055_2215.pdf | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-13 Solderability Test Report_JBD_SQE_308.03523.135_2224.pdf | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-01 Solderability Test Report_JBD_SQE_308.03524.055_2215.pdf | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-03 Solderability Test Report_JBD_SQE_308.03581.055_2215.pdf | |
| 2023-03-20 16:46 | (ALTech) SH Son | File Added: VN20230218003-05 Solderability Test Report_JBD_SQE_308.03582.055_D2215.pdf | |
| 2023-03-20 16:52 | (ALTech) SH Son | Note Added: 0012581 | |
| 2023-03-20 17:17 | (SW) Kerwin Chen | Severity | s2-severe => s3-moderate |
| 2023-07-14 12:39 | (ALTech) SH Son | Note Added: 0013629 | |
| 2025-04-07 10:08 | (PM) Sheila Tu | Status | assigned => closed |
| 2025-04-07 10:08 | (PM) Sheila Tu | Resolution | open => fixed |
.png)
.png)